12A1 Wafer Hub Dicing Pom Hniav Pob Zeb Diamond Dicing Rau Wafer Scrosing

12A1 Wafer Hub Dicing Pom Hniav Pob Zeb Diamond Dicing Rau Wafer SCRibing Featured Duab

Cov lus piav qhia luv luv:

Pob zeb diamond dicing hniav yog siv rau grooving, tej silicon wafer, compound semiconductors, iav thiab lwm yam ntaub ntawv hauv cov ntaub ntawv hauv tshuab hluav taws xob. Peb cov hniav sib tov muaj xws li pob zeb diamond hub dicing hniav thiab pob zeb diamond hubress dicing hniav. Lub binders suav nrog cov nyiaj cob haum dicing hniav hniav, hlau sib khi dicing hniav hniav thiab hluav taws xob plab zom mov thiab hluav taws xob.

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Khoom Qhia Qhia

Khoom Ntawv

Daim Ntawv Thov: Scriping Dicing Ic Wafers, Gallium phosphide, Allows Ncej, Ceramic Substrate, Ceramite Board nrog interlayer, thiab lwm yam
Yuav xaiv hom kev nyab xeeb ntawm wafer dicing tuaj txiav cov khoom?
* Binder ntawm Resin Bond (mos muaj zog) dicing hniav, scribing nyuaj thiab cov khoom siv loj
* Binder ntawm hlau sib khi (nruab nrab lub zog) dicing hniav hniav
* Binder ntawm electroplated daim ntawv cog lus (nyuaj nyiaj), scribing cov khoom softer softer

Qhov zoo ntawm Wafer Hub Dicing Pom Tuaj
Siab Precision txiav - ua kom huv si huv thiab raug dicing nrog tsawg kawg chipping.
Superior hniav rigidity - txo cov hniav kev co rau kev hloov kho qhov ruaj khov.
Nyias kerf tsim - minimizes cov khoom poob thiab txhim kho cov lus tau.
Kev txuas hniav hniav lub neej - optimized rau kev ua haujlwm ruaj khov thiab ua kom zoo ib yam.
Customizable specifications - muaj nyob rau hauv cov tuab tuab, muaj cov tuab tuab, diameters, thiab grit ntau thiab tsawg kom phim daim ntawv thov.