6A2T coj substrate hlau khi rov qab sib tsoo lub log pob zeb diamond sib tsoo

Cov lus piav qhia luv luv:

Lub pob zeb diamond rov qab sib tsoo yog siv dav hauv kev lag luam hluav taws xob xws li cov khoom sib tsoo, uas yog qhov sib tsoo sib tsoo wafers.diamond sib tsoo cov log yog qhov kev xaiv nkaus xwb.


Khoom Qhia Qhia

Khoom Ntawv

1.Metal pob zeb diamond sib tsoo yog tsuas yog siv rau rov qab thinning ntawm sapphire epitaxial wafers, silicon cov chips, thiab gan chips hauv lub LED kev lag luam. Lub nraub qaum sib tsoo rau LED Substrate tau raug xa tawm mus rau ntau lub tebchaws, nrog kev sib tsoo zoo dua thiab cov nqi siab-ua tau zoo.
2. Workpiece ua tiav: sapphire epitaxial wafer, sic substrate epitaxial wafer, si subfate epitaxial wafer.
3.Material ntawm workpiece: synthetic sapphire, sic, tib lub siv lead ua silicon.
4.Grinders: Shuwa, NTSE, WEC, Galaxy, ceevfam, Okamoto.

Khoom npe
Rov Qab Sib Tsoo Log Rau Led Substrate
Sib khi
Hlau
Lub cev
6A2T
Qhov loj
209mm, 254mm, 313mm, Mekas
Khoom siv khoom
Synthetic Sapphire, Sic, Ib Leeg Crystal Silicon
2022100107034190.jpg_ 看图王 .web
202200107033781.jpg_ 看图王 .web

1.Qhov Precision ntawm cov av ua haujlwm thiab zoo nto zoo
2.Qhov zoo tuav ntawm lub workpiece
3.High grinding efficievic
4.Low sib tsoo lub zog thiab cov kub sib tsoo

LED Subfub Sib Tsoo (3)

  • Yav dhau los:
  • Tom ntej: