1.Metal pob zeb diamond sib tsoo yog tsuas yog siv rau rov qab thinning ntawm sapphire epitaxial wafers, silicon cov chips, thiab gan chips hauv lub LED kev lag luam. Lub nraub qaum sib tsoo rau LED Substrate tau raug xa tawm mus rau ntau lub tebchaws, nrog kev sib tsoo zoo dua thiab cov nqi siab-ua tau zoo.
2. Workpiece ua tiav: sapphire epitaxial wafer, sic substrate epitaxial wafer, si subfate epitaxial wafer.
3.Material ntawm workpiece: synthetic sapphire, sic, tib lub siv lead ua silicon.
4.Grinders: Shuwa, NTSE, WEC, Galaxy, ceevfam, Okamoto.
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1.Qhov Precision ntawm cov av ua haujlwm thiab zoo nto zoo
2.Qhov zoo tuav ntawm lub workpiece
3.High grinding efficievic
4.Low sib tsoo lub zog thiab cov kub sib tsoo

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Vitrified Daim Ntawv Nyiaj CBN Sib Tsoo Log Rau Crankshaf ...
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1F1 14f1 Profile Sib Tsoo Pob Zeb Diamond CBN Sib Tsoo ...
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6A2 Vitrified Nyiaj Pob Zeb Diamond CBN Sib Tsoom Log F ...
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Camshaft crankshaft sib tsoo vitrified Daim Ntawv Nyiaj Txiag CBN ...
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1A1 3A1 14A1 tiaj tus parallel ncaj resin resin bond ...
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High efficiency hlau khi cbn sib tsoo log log g ...